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  minimum instruction execution time 0.10 s (at 4.5 v to 5.5 v, 20 mhz) 0.238 s (at 2.7 v to 5.5 v, 8.39 mhz) 0.477 s (at 2.0 v to 5.5 v, 4.19 mhz)* * the lower limit for operation guarantee for flash memory built-in type is 2.5 v. interrupts ? reset  watchdog  external 0  external 1  external 2  timer 0  timer 1  timer 2  timer 3  timer 4  timer 5  time base  serial 0  a/d conversion finish timer counter timer counter 0 : 8-bit 1 (square-wave/8-bit pwm output, event count, generation of remote control carrier) clock source 1/1, 1/4 of system clock frequency; 1/1 of osc oscillation clock frequency; external clock input interrupt source coincidence with compare register 0 timer counter 1 : 8-bit 1 (square-wave output, event count, synchronous output event) clock source 1/16, 1/64 of system clock frequency; external clock input interrupt source coincidence with compare register 1 timer counter 0, 1 can be cascade-connected. timer counter 2 : 8-bit 1 (square-wave/8-bit pwm output, event count, synchronous output event) clock source 1/1, 1/4 of system clock frequency; external clock input interrupt source coincidence with compare register 2 timer counter 3 : 8-bit 1 (square-wave output, event count, generation of r emote control carrier, serial 0 baud rate timer) clock source 1/4, 1/16 of system clock frequency; 1/1 of osc oscillation clock frequency; external clock input interrupt source coincidence with compare register 3 timer counter 2, 3 can be cascade-connected. timer counter 4 : 16-bit 1 (square-wave/16-bit pwm output, event count , synchronous output event, input capture) clock source 1/4, 1/16 of system clock frequency; 1/1 of osc oscillation clock frequency; external clock input interrupt source coincidence with compare register 4 time base timer (one-minute count setting, independently operable 8-bit timer counter 5) clock source 1/4 of system clock frequency; 1/1, 1/8192 of osc oscillation clock frequency interrupt source coincidence with compare register 5; 1/8192 prescaler overflow watchdog timer interrupt source 1/1048576 of system clock frequency ram ( 8-bit) rom ( 8-bit) 32 k type MN101C94A (es (engineering sample) available) package 1 k qfp044-p-1010f *lead-free MN101C94A mad00052aem
MN101C94A serial interface serial 0 : synchronous type/simple uart (half-duplex) 1 clock source 1/2, 1/4, 1/16 of system clock frequency; output of timer counter 3 limit symbol condition min typ max unit idd1 f osc = 20 mhz, vdd = 5 v 15 40 ma idd2 f osc = 8.39 mhz, vdd = 5 v 6 18 ma idd3 ff osc = 8.39 mhz, vdd = 5 v, ta = 25 c 1.2 3 ma idd4 vdd = 5 v, ta = 25 c2 a idd5 vdd = 5 v, ta = ? 40 c to +85 c 20(50) a parameter electrical characteristics supply current pin assignment qfp044-p-1010f * lead-free MN101C94A p64 p65 p66 p67 p70 nrst,p27 mmod led7,p87 led6,p86 led5,p85 led4,p84 led3,p83 led2,p82 led1,p81 led0,p80 an0,pa0 an1,pa1 an2,pa2 an3,pa3 an4,pa4 an5,pa5 an6,pa6 p63 p62 p61 p60 p22,irq2 p21,irq1 p20,irq0 p14,tmio4 p13,tmio3 p12,tmio2 p11 p10,rmout p06,buzzer p02,sbt0 p01,sbi0,rxd p00,sbo0,txd n.c. v ss osc1 osc2 v dd pa7,an7 34 35 36 37 38 39 40 41 42 43 44 22 21 20 19 18 17 16 15 14 13 12 33 32 31 30 29 28 27 26 25 24 23 1 2 3 4 5 6 7 8 9 10 11 mad00052aem operating supply current supply current at halt supply current at stop ( ) : flash memory built-in type i/o pins 26  common use: 17  specified pull-up resistor available  input/output selectable (bit unit): 26 i/o special ports buzzer output, remote control carrier signal output, high-current drive port a/d inputs 10-bit 8-ch. (with s/h) 11  common use  specified pull-up resistor available input
type mn101cf94d (es (engineering sample) available) rom ( 8-bit) 64 k ram ( 8-bit) 2 k minimum instruction execution time 0.10 s (at 4.5 v to 5.5 v, 20 mhz) 0.238 s (at 2.7 v to 5.5 v, 8.39 mhz) 0.477 s (at 2.5 v to 5.5 v, 4.19 mhz) package qfp044-p-1010f *lead-free support tool flash memory built-in type in-circuit emulator px-ice101c/d+px-prb101c94-qfp044-p-1010 mad00052aem
MN101C94A mad00052aem
request for your special attention and precautions in using the technical information and semiconductors described in this material (1) an export permit needs to be obtained from the competent authorities of the japanese government if any of the products or technical information described in this material and controlled under the "foreign exchange and foreign trade law" is to be exported or taken out of japan. (2) the technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. it neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) we are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) the products described in this material are intended to be used for standard applications or general elec- tronic equipment (such as office equipment, communications equipment, measuring instruments and house- hold appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combus- tion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (5) the products and product specifications described in this material are subject to change without notice for modification and/or improvement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifica- tions satisfy your requirements. (6) when designing your equipment, comply with the guaranteed values, in particular those of maximum rat- ing, the range of operating power supply voltage, and heat radiation characteristics. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) when using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) this material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of matsushita electric industrial co., ltd. 2003 sep


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